1.5g Silver CPU Heatsink Thermal Paste Syringe
H1619
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DISCONTINUED |
This item is no longer available to purchase. |
Overview
Contains silver for more efficient heat transfer than standard thermal paste compound. Supplied in a syringe pack for easy dispensing.
Features
- Increases thermal conductivity between CPU and heat sink
- Helps dissipate damaging heat to prolong CPU life
- Syringe dispenser with resealable cap for precise and easy application
Information & Downloads
- Altronics Code: H1619
- I/N: 13249
- Shipping Weight: 0.04000Kg
- Packaging Sizes
- EACH: 1
- Printed Catalogue Page 298
- Large Image 1
Specifications
- Dimensions: 55W x 5D x 55H
- Weight: 1.5g
- Thermal conductivity: 2.17W/m-k
- Temperature usage: -50º - 170ºC
- Thermal impedance: 0.06ºC/W
*Specifications are subject to change without notice.
Warranty & Returns
12 MONTHS
We offer 12 months warranty on this product from its date of purchase. This is available from Altronics stores, online purchases or Altronics resellers. In accordance with our full warranty terms we will repair, replace or refund if goods you have purchased from us are defective.
14 DAY MONEY BACK GUARANTEE
Not withstanding our warranty policy, if you are dissatisfied with our goods or service you may return the goods within 14 days of our despatch date. Simply contact us for a return authorisation number and we will refund your purchase in full, less transport costs on receipt of goods. All returned goods must be in as sold condition including all packaging, instructions, invoices etc.
